【英文市場調査レポート】 薄型ウエハーの世界市場:サイズ別、用途別2025年予測 Thin Wafer Market with COVID-19 impact analysis by Wafer Size (125 mm, 200 mm, and 300 mm), Process (Temporary Bonding &Debonding and Carrier-less/Taiko Process), Technology , Application, and Geography - Global Forecast to 2025 http://researchstation.jp/report/MAM/21/Thin_Wafer_2025_MAM2168.html